.E.T., (former SUSS MicroTec Device Bonder Division), supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography Solutions announced that the partnership between S.E.T. and CEA Leti has resulted in a new generation high accuracy (0.5 µm), high force (4,000 N) Device Bonder for wafer diameters up to 300 mm. It includes a built-in Chamber for collective reflow in a gas or vacuum environment. The system also features Nanoimprinting capabilities. The new Device Bonder, called FC300 High Force Device Bonder, is the first step in a joint development program between CEA Leti and S.E.T. A previous joint development effort, as early as 1981, brought about the first ever commercially available flip chip bonder. The FC300 is able to perform various applications on the same platform with a quick process head reconfiguration. Available at first with automatic handling of chips, templates and small size substrates, the FC300 will be further developed to include a fully automated handling of wafers up to 300 mm. The flexible design of the FC300 features different configurations: High Force, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography process; Low Force bonding; for reflow bonding of RF & optoelectronics devices assembly; UV-Curing for adhesive Bonding or for Nanoimprint using the UV-NIL process.